Proċess SMT tat-teknoloġija tal-impunjazzjoni tal-wiċċ

May 14, 2025

Ħalli messaġġ

Assemblea fuq naħa waħda
Incoming material inspection => Silk screen solder paste (sMD glue) => SMD => Drying (curing) => Reflow soldering => Cleaning => Inspection =>Xogħol mill-ġdid
Assemblaġġ b'żewġ naħat
A: Incoming material inspection => Silk screen solder paste (sMD glue) on PCB A side => SMD PCB Silk screen solder paste (sMD glue) on PCB B side => SMD => Drying => Reflow soldering (preferably only on B side => Cleaning => Inspection =>Xogħol mill-ġdid) .
B: Incoming material inspection => Silk screen solder paste (sMD glue) on PCB A side => SMD => Drying (curing) => Reflow soldering on A side => Cleaning => Flip board => SMD glue on PCB B side => SMD => Curing => Wave soldering on B side => Cleaning => Inspection =>Xogħol mill-ġdid)
Dan il-proċess huwa adattat għall-issaldjar li jirrifletti fuq il-PCB A Side and Wave Saldering on B Side . Dan il-proċess huwa adattat għall-SMDs immuntati fuq in-naħa B tal-PCB meta hemm biss SOT jew SOIC (28) pin jew inqas {.
Proċess ta 'assemblaġġ imħallat b'ġenb wieħed
Incoming material inspection => Screen printing solder paste on the A side of the PCB (applying SMD glue) => SMD => Drying (curing) => Reflow soldering => Cleaning => Plug-in => Wave soldering => Cleaning => Inspection =>Xogħol mill-ġdid
Proċess ta 'assemblaġġ imħallat b'żewġ naħat
A: Incoming material inspection => Apply SMD glue on the B side of the PCB => SMD => Curing => Flip board => Plug-in on the A side of the PCB => Wave soldering => Cleaning => Inspection =>Xogħol mill-ġdid
Applika l-ewwel u mbagħad daħħal, li hija adattata għas-sitwazzjoni fejn hemm aktar komponenti SMD minn komponenti diskreti .
B: Incoming material inspection => Plug-in on the A side of the PCB (pin bending) => Flip board => Apply SMD glue on the B side of the PCB => SMD => Curing => Flip board => Wave soldering => Cleaning => Inspection =>Xogħol mill-ġdid
Daħħal l-ewwel u mbagħad applika, li hija adattata għas-sitwazzjoni fejn hemm aktar komponenti diskreti minn komponenti SMD .
C: Incoming material inspection => PCB A side screen printing solder paste => SMD => Drying => Reflow soldering => Plug-in, pin bending => Flip board => PCB B side SMD glue => SMD => Curing => Flip board => Wave soldering => Cleaning => Inspection =>Erġa 'ħadem assemblaġġ imħallat tal-ġenb, b ġenb smd .
D: Incoming material inspection => PCB B side SMD glue => SMD => Curing => Flip board => PCB A side screen printing solder paste => SMD => Reflow soldering => Plug-in => Wave soldering => Cleaning => Inspection => Rework A side mixed assembly, B side SMD. First paste SMD on both sides, reflow soldering, then plug-in, wave soldering E: Incoming material inspection => Silk screen solder paste (smear patch glue) on the B side of the PCB => Smear => Drying (curing) => Reflow soldering => Flip board => Silk screen solder paste on the A side of the PCB => Smear => Drying = Reflow soldering 1 (local soldering can be used) => Plug-in => Wave soldering 2 (if there are few plug-in components, manual soldering can be used) => Cleaning => Inspection =>Ibdel mill-ġdid l-immuntar tal-ġenb, b immuntar imħallat tal-ġenb .
Proċess ta 'assemblaġġ b'żewġ naħat
A: Spezzjoni tal-materjal li deħlin, pejst tal-istann tal-iskrin tal-ħarir (kolla tal-garża) fuq in-naħa tal-PCB, tfixkil, tnixxif (tfittxija), issaldjar tal-ġenb li jirrifletti, tindif, flip board; Pejst tal-istann tal-iskrin tal-ħarir (kolla tal-garża) fuq in-naħa B tal-PCB, smear, tnixxif, issaldjar li jirrifletti (preferibbilment biss għan-naħa B, tindif, spezzjoni, xogħol mill-ġdid)
Dan il-proċess huwa adattat għall-immuntar ta 'SMDs kbar bħal PLCC fuq iż-żewġ naħat tal-PCB .
B: Spezzjoni tal-materjal li deħlin, pejst tal-istampar tal-iskrin fuq in-naħa tal-PCB (applikazzjoni ta 'kolla SMD), SMD, tnixxif (tfittxija), issaldjar li jirrifletti fuq in-naħa A, tindif, u flipping; Applikazzjoni tal-kolla SMD fuq in-naħa B ta 'PCB, SMD, tqaddid, issaldjar tal-mewġ fuq in-naħa B, tindif, spezzjoni, u xogħol mill-ġdid) Dan il-proċess huwa adattat għar-riflessjoni fuq in-naħa A tal-PCB .

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